Intel wins US billions
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Intel will receive $3 billion to keep America’s chip supply chain in-house.
Intel has been awarded up to $3 billion by the Biden-Harris Administration in the US to further bolster secure semiconductor manufacturing through the Secure Enclave program.
This funding is part of the CHIPS and Science Act, which aims to enhance the United States' ability to produce advanced semiconductors domestically, with a particular focus on the needs of the US government.
Intel says its Secure Enclave program will strengthen national security by securing the domestic supply chain of semiconductors, an essential component for defence and other critical technological systems.
The program builds upon Intel’s prior collaborations with the US Department of Defense (DoD), particularly through the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) and the State-of-the-Art Heterogeneous Integration Prototype (SHIP) initiatives.
As the sole American company that designs and manufactures cutting-edge logic chips, Intel says its role in the partnership is central to US efforts to maintain leadership in microelectronics and advanced manufacturing technologies.
“Intel is proud of our ongoing collaboration with the U.S. Department of Defense to help strengthen America’s defense and national security systems,” said Chris George, president and general manager of Intel Federal.
The Secure Enclave award is independent of Intel’s separate agreement with the US government, which was reached in March 2024 under the same CHIPS Act.
That deal is focused on expanding and modernising Intel’s commercial semiconductor production facilities.
Intel Foundry Services, a unit within Intel responsible for providing semiconductor manufacturing capabilities to external customers, continues to make significant progress.
The company’s most advanced technology, Intel 18A, is expected to enter production by 2025, representing a milestone in the company's efforts to support high-volume manufacturing for both commercial and government needs.
Intel’s relationship with the DoD includes its involvement in the SHIP program.
Through this initiative, Intel has delivered multi-chip package prototypes, allowing the U.S. government to access its advanced semiconductor packaging capabilities.
In addition, Intel is involved in the RAMP-C program, which involves producing custom integrated circuits for the DoD’s critical systems.
The company says it has successfully onboarded major players in the defence industrial base, including Boeing, Northrop Grumman, and Nvidia, as well as tech giants Microsoft and IBM.